? semiconductor components industries, llc, 2012 november, 2012 ? rev. 0 1 publication order number: EMI2180/d EMI2180 common mode filter with esd protection functional description the EMI2180 is an industry first common mode filter tuned to mhl speed (cmf) with integrated esd protection. differential signaling i/os can now have both common mode filtering and esd protection in one package, instead of using separate devices for each function. in addition, traditional common mode chokes are coil ? based, while the EMI2180 is silicon ? based. this enables the EMI2180 to have a smaller footprint and profile. the EMI2180 protects against esd pulses up to 8 kv contact per the iec61000 ? 4 ? 2 standard. the EMI2180 is particularly well ? suited for protecting systems using high ? speed differential ports such as mhl , mhl to usb interface corresponding ports in removable storage, digital camcorders, dvd ? rw drives; and other applications where esd protection are required in a small footprint package. the EMI2180 is available in a rohs ? compliant, wdfn - 8 package . features ? single integrated package for common mode filter (cmf) and esd protection for mhl high speed data lines ? high differential mode bandwidth cutoff frequency for best signal integrity ? low profile with small footprint in wdfn6 1.6 x 2. 0 mm package ? provides esd protection to iec61000 ? 4 ? 2 level 4, 8 kv contact discharge ? low channel input capacitance ? these devices are pb ? free and are rohs compliant applications ? i/o ports, display, mhl in mobile phones, wireless handsets and cameras ? mhl to usb interface ? high ? speed differential data lines figure 1. EMI2180 electrical schematic 1 2 4 5 6 wdfn6 case 511bv marking diagram http://onsemi.com (*note: microdot may be in either location) pin connections device package shipping ? ordering information ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our t ape and reel packaging specifications brochure, brd8011/d. EMI2180mttbg wdfn6 (pb ? free) 3000 / tape & reel 1 2 3 6 5 4 in 1+ in 1 ? nc out 1+ out 1 ? vcc (top view) 2m = specific device code m = date code = pb ? free package 2m m 1 1 6 gnd pad http://www..net/ datasheet pdf - http://www..net/
EMI2180 http://onsemi.com 2 pin function description pin name pin no. type description mhl_in+ 1 i/o cmf channel 1+ to connector mhl_in ? 2 i/o cmf channel 1 ? to connector mhl_out+ 6 i/o cmf channel 1+ to asic mhl_out ? 5 i/o cmf channel 1 ? to asic vcc 4 vcc nc 3 nc no connect gnd belly pad gnd gnd absolute maximum ratings (t a = 25 c unless otherwise noted) parameter symbol value unit operating temperature range to p ? 40 to +85 c storage temperature range tstg ? 65 to +150 c dc voltage at any channel input vdc ? 0.5 to 5.5 v esd discharge iec61000 ? 4 ? 2 contact discharge v pp 8 kv maximum lead temperature for soldering purposes (1/8? from case for 10 seconds) tl 260 c stresses exceeding maximum ratings may damage the device. maximum ratings are stress ratings only. functional operation above t he recommended operating conditions is not implied. extended exposure to stresses above the recommended operating conditions may af fect device reliability. http://www..net/ datasheet pdf - http://www..net/
EMI2180 http://onsemi.com 3 electrical characteristics (t a = 25 c unless otherwise noted) symbol parameter test conditions min typ max unit i leak channel leakage current t a = 25 c, v in = 5 v, v n = 0 v 1.0 a v f channel negative voltage i f = 10 ma, t a = 25 c 0.1 1.5 v c id channel id capacitance (pin 4 to gnd) t a = 25 c, at 1 mhz, v n = 0 v 0.8 1.3 pf c in channel input capacitance (pins 1, 2 to gnd) t a = 25 c, at 1 mhz, v n = 0 v 2.0 pf r ch channel resistance (pins 1 ? 6 and 2 ? 5) t a = 25 c, at 1 mhz, v n = 0 v 3.5 5.0 f 3db differential mode (sdd21) cut ? off frequency 50 source and load termination 4.0 ghz f attn common mode (scc21) stop band attenuation @ 75 mhz 3 db @ 500 mhz 10 db @ 1 ghz ~ 3 ghz 15 db f attn mode ? to ? mode conversion (sdc21, scd21) up to 6 ghz 40 35 db v esd esd protection ? peak discharge voltage at any channel input, in system: contact discharge per iec61000 ? 4 ? 2 standard t a = 25 c, (notes 2 and 3) 8 kv v rwm reverse working voltage (note 3) 5.0 v v br breakdown voltage it = 1 ma, (note 4) 5.6 9.0 v 1. standard iec61000 ? 4 ? 2 with c discharge = 150 pf, r discharge = 330, v n grounded. 2. these measurements performed with no external capacitor. 3. tvs devices are normally selected according to the working peak reverse voltage (v rwm ), which should be equal or greater than the dc or continuous peak operating voltage level 4. v br is measured at pulse test current i t . typical characteristics figure 2. differential mode attenuation vs. frequency figure 3. common mode attenuation vs. frequency ? 7 ? 6 ? 5 ? 4 ? 3 ? 2 ? 1 ? 9 0 ? 8 1e6 1e7 1e8 1e9 1e10 db frequency (hz) ? 35 ? 30 ? 25 ? 20 ? 15 ? 10 ? 5 ? 40 0 db frequency (hz) 1e6 1e7 1e8 1e9 1e10 http://www..net/ datasheet pdf - http://www..net/
EMI2180 http://onsemi.com 4 transmission line pulse (tlp) measurements transmission line pulse (tlp) provides current versus voltage (i ? v) curves in which each data point is obtained from a 100 ns long rectangular pulse from a charged transmission line. a simplified schematic of a typical tlp system is shown in figure 4. tlp i ? v curves of esd protection devices accurately demonstrate the product?s esd capability because the 10 s of amps current levels and under 100 ns time scale match those of an esd event. this is illustrated in figure 5 where an 8 kv iec61000 ? 4 ? 2 current waveform is compared with tlp current pulses at 8 and 16 a. a tlp curve shows the voltage at which the device turns on as well as how well the device clamps voltage over a range of current levels. typical tlp i ? v curves for the EMI2180 are shown in figure 6. figure 4. simplified schematic of a typical tlp system dut v m i m l 10 m v c sw oscilloscope attenuator 50 coax cable 50 coax cable figure 5. comparison between 8 kv iec61000 ? 4 ? 2 and 8 a and 16 a tlp waveforms figure 6. positive and negative tlp waveforms http://www..net/ datasheet pdf - http://www..net/
EMI2180 http://onsemi.com 5 esd voltage clamping for sensitive circuit elements it is important to limit the voltage that an ic will be exposed to during an esd event to as low a voltage as possible. the esd clamping voltage is the voltage drop across the esd protection diode during an esd event per the iec61000 ? 4 ? 2 waveform. since the iec61000 ? 4 ? 2 was written as a pass/fail spec for larger systems such as cell phones or laptop computers it is not clearly defined in the spec how to specify a clamping voltage at the device level. on semiconduct or has developed a way to examine the entire voltage waveform across the esd protection diode over the time domain of an esd pulse in the form of an oscilloscope screenshot, which can be found on the datasheets for all esd protection diodes. for more information on how on semiconductor creates these screenshots and how to interpret them please refer to on semiconductor application notes and8307/d and and8308/d. iec61000 ? 4 ? 2 spec. level test voltage (kv) first peak current (a) current at 30 ns (a) current at 60 ns (a) 1 2 7.5 4 2 2 4 15 8 4 3 6 22.5 12 6 4 8 30 16 8 i peak 90% 10% iec61000 ? 4 ? 2 waveform 100% i @ 30 ns i @ 60 ns t p = 0.7 ns to 1 ns 50 50 cable tvs oscilloscope esd gun figure 7. diagram of esd test setup figure 8. 8 x 20 s pulse waveform 100 90 80 70 60 50 40 30 20 10 0 020406080 t, time ( s) % of peak pulse current t p t r pulse width (t p ) is defined as that point where the peak current decay = 8 s peak value i rsm @ 8 s half value i rsm /2 @ 20 s http://www..net/ datasheet pdf - http://www..net/
EMI2180 http://onsemi.com 6 figure 9. esd clamping voltage +8 kv per iec6100 ? 4 ? 2 (external to internal pin) figure 10. esd clamping voltage ? 8 kv per iec6100 ? 4 ? 2 (external to internal pin) http://www..net/ datasheet pdf - http://www..net/
EMI2180 http://onsemi.com 7 package dimensions wdfn6 1.6x2.0, 0.5p case 511bv issue o notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. 3. dimension b applies to plated terminal and is measured between 0.15 and 0.20 mm from the terminal tip. 4. coplanarity applies to the exposed pad as well as the terminals. a b e d d2 e2 bottom view b e 6x 0.10 b 0.05 a c c k note 3 2x 0.10 c pin one reference top view 2x 0.10 c note 4 a a1 (a3) 0.05 c 0.05 c c seating plane side view l 6x 13 4 6 dim min max millimeters a 0.60 0.80 a1 0.00 0.05 a3 0.20 ref b 0.20 0.40 d 1.60 bsc d2 1.10 1.30 e 2.00 bsc e2 0.95 1.15 e 0.50 bsc k 0.20 ??? l 0.15 0.35 *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. mounting footprint ?? 1.30 1.15 0.50 0.43 6x 2.30 dimensions: millimeters 0.36 1 6x l1 ??? 0.10 l1 detail a l optional constructions l pitch recommended on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to mak e changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for an y particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different application s and actual performance may vary over time. all operating parameters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its of ficers, employees, subsidiaries, af filiates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. EMI2180/d publication ordering information n. american technical support : 800 ? 282 ? 9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81 ? 3 ? 5817 ? 1050 literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303 ? 675 ? 2175 or 800 ? 344 ? 3860 toll free usa/canada fax : 303 ? 675 ? 2176 or 800 ? 344 ? 3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your local sales representative http://www..net/ datasheet pdf - http://www..net/
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